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Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s Short-Reach Transmission.
Ying Zhao
Li Chen
Ricardo Aroca
Ninghui Zhu
Dinh Ton
David Inglis
Christopher Doerr
Published in:
OFC (2021)
Keyphrases
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high speed
low cost
data transmission
neural network
assembly systems
end to end
high density