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Performance Characterization of TSV in 3D IC via Sensitivity Analysis.

Jhih-Wei YouShi-Yu HuangDing-Ming KwaiYung-Fa ChouCheng-Wen Wu
Published in: Asian Test Symposium (2010)
Keyphrases
  • sensitivity analysis
  • managerial insights
  • influence diagrams
  • integrated circuit
  • variational inequalities
  • computer vision
  • rbfnn
  • face recognition
  • pattern recognition
  • face images