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Evaluation of TSV and micro-bump probing for wide I/O testing.

Ken SmithPeter HanawayMike JolleyReed GleasonEric StridTom DaenenLuc DupasBruno KnutsErik Jan MarinissenMarc Van Dievel
Published in: ITC (2011)
Keyphrases
  • wide range
  • evaluation method
  • database
  • neural network
  • real world
  • artificial intelligence
  • input output
  • multiscale
  • multi dimensional
  • gold standard