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High-speed solder bump inspection system using a laser scanner and CCD camera.
Hiroyuki Tsukahara
Yoji Nishiyama
Fumiyuki Takahashi
Takashi Fuse
Toru Nishino
Moritoshi Ando
Published in:
Systems and Computers in Japan (2000)
Keyphrases
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ccd camera
laser scanner
high speed
frame rate
printed circuit boards
point cloud
stereo camera
high resolution
color information
personal computer
vision system
real time
time of flight
multi sensor
weather conditions
depth information
surface reconstruction
video sequences
image processing