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Global interconnect design in a three-dimensional system-on-a-chip.
James W. Joyner
Payman Zarkesh-Ha
James D. Meindl
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2004)
Keyphrases
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three dimensional
high speed
single chip
design process
physical design
low cost
power dissipation
building blocks
computer aided
circuit design
chip design
database
user interface
x ray
design methodology
cmos technology