TSV process solution for 3D-IC.

Satoru Toyoda A. Shibata M. Harada Takahide Murayama Toshiyuki Sakuishi M. Hatanaka Yasuhiro Morikawa Koukou Suu

Published in: 3DIC (2011)

Keyphrases

neural network
machine learning
image processing
optimal solution
process model
real world
clustering algorithm
three dimensional
multiscale
preprocessing
special case
development process