Takahide Murayama

Publication Activity (10 Years)

Years Active: 2011-2015
Publications (10 Years): 1

Top Topics

Integrated Circuit

High Reliability

Video Sequences

Top Venues

Publications

Takahide Murayama, Yasuhiro Morikawa
TSV etching and VDP process integration for high reliability. 3DIC (2015)
Satoru Toyoda, A. Shibata, M. Harada, Takahide Murayama, Toshiyuki Sakuishi, M. Hatanaka, Yasuhiro Morikawa, Koukou Suu
TSV process solution for 3D-IC. 3DIC (2011)