An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics.
Rafid Adnan KhanSaad YousafGordon W. RobertsPublished in: IEEE Trans. Circuits Syst. II Express Briefs (2023)
Keyphrases
- test data
- preprocessing
- similarity measure
- integrated circuit
- dynamic programming
- high precision
- statistical significance
- fully automatic
- detection method
- theoretical analysis
- computationally efficient
- high accuracy
- computational cost
- experimental evaluation
- prior knowledge
- support vector machine svm
- optimization algorithm
- mutual information
- image processing