Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs.

Nauman H. Khan Syed M. Alam Soha Hassoun

Published in: 3DIC (2009)

Keyphrases

random noise
noise level
low snr
noisy data
social networks
signal to noise ratio
noise reduction
additive noise
image noise
noise free
information systems
case study
image segmentation
three dimensional
high density
noise removal