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Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties.

Yao HsuChih-Yen SuWen-Fang Wu
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • reliability analysis
  • solder ball connect
  • power plant
  • infrared
  • neural network
  • soft computing
  • genetic algorithm
  • decision support system