Login / Signup
Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties.
Yao Hsu
Chih-Yen Su
Wen-Fang Wu
Published in:
Microelectron. Reliab. (2011)
Keyphrases
</>
reliability analysis
solder ball connect
power plant
infrared
neural network
soft computing
genetic algorithm
decision support system