3D thermal-ADI: an efficient chip-level transient thermal simulator.

Ting-Yuan Wang Yu-Min Lee Charlie Chung-Ping Chen

Published in: ISPD (2003)

Keyphrases

infrared
power plant
solder ball connect
injection lasers
thermal imaging
visible spectrum
finite element analysis
levels of abstraction
high speed
low cost
simulation model
single chip
air temperature
steady state
wireless sensor networks
video sequences
information systems
data sets