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Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading.

Y. L. ZhangD. X. Q. ShiWei Zhou
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • user interface
  • neural network
  • genetic algorithm
  • case study
  • information technology
  • empirical studies
  • statistical analysis
  • human computer interaction
  • reliability analysis