US Microelectronics Packaging Ecosystem: Challenges and Opportunities.
Rouhan NoorHimanandhan Reddy KotturPatrick J. CraigLiton Kumar BiswasM. Shafkat M. KhanNitin VarshneyHamed DalirElif AkçaliBahar Ghane MotlaghCharles WoychikYong-Kyu YoonNavid AsadizanjaniPublished in: CoRR (2023)