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Scenario for catastrophic failure in interconnect structures under chip package interaction.

Masaki OmiyaShoji KamiyaNobuyuki ShishidoKozo KoiwaHisashi SatoMasahiro NishidaTakashi SuzukiTomoji NakamuraToshiaki SuzukiTakeshi Nokuo
Published in: IRPS (2015)
Keyphrases
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