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Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading.

Ping YangDongjing LiuYanfang ZhaoYunqing TangHuan Wang
Published in: IEEE Trans. Reliab. (2013)
Keyphrases
  • prediction accuracy
  • high density
  • design process
  • high speed
  • prediction model
  • data sets
  • machine learning
  • decision making
  • bayesian networks
  • evolutionary algorithm
  • prediction algorithm
  • mechanical properties