A Post-Bond TSV Test Method Based on RGC Parameters Measurement.
Yang YuXu FangXiyuan PengPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2020)
Keyphrases
- dynamic programming
- cost function
- preprocessing
- prior knowledge
- parameter space
- high accuracy
- clustering method
- detection method
- high precision
- sensitivity analysis
- computationally efficient
- test data
- parameter selection
- neural network
- optimization method
- closed form
- classification method
- segmentation algorithm
- computational cost
- color images
- pairwise