Contact and junction engineering in bulk FinFET technology for improved ESD/latch-up performance with design trade-offs and its implications on hot carrier reliability.
Milova PaulBoeila Sampath KumarHarald GossnerMayank ShrivastavaPublished in: IRPS (2018)
Keyphrases
- trade off
- design process
- engineering design
- case study
- mechanical engineering
- design requirements
- engineering students
- engineering education
- product design
- electrical engineering
- cost effective
- human factors
- enabling technology
- artificial intelligence
- design space
- design choices
- systems engineering
- design methodology
- computer aided
- computer systems
- user interface
- participatory design
- web services
- information systems