An on-chip thermal stress evaluation method for silicon resonant accelerometer.
Guo Ming XiaQin ShiAn Ping QiuXuehao YuZhonghai PeiPublished in: IEEE SENSORS (2016)
Keyphrases
- evaluation method
- high density
- high speed
- low cost
- cmos technology
- evaluation methods
- infrared
- evaluation model
- frequency band
- credit risk
- gesture recognition
- metal oxide semiconductor
- low power
- activity recognition
- silicon on insulator
- power plant
- finite element analysis
- fuzzy comprehensive evaluation
- analytic hierarchy process
- field effect transistors
- pulse width