100 mum Pitch flip chip on foil assemblies with adhesive interconnections.

J. de Vries J. van Delft C. Slob

Published in: Microelectron. Reliab. (2005)

Keyphrases

high density
low cost
inductive logic programming
high speed
analog vlsi
printed circuit boards
high bandwidth
host computer
programmable logic
single chip
rule learning
relational learning
vlsi design
physical design
data center
background knowledge
relational data
machine learning