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Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias.
Debika Chaudhuri
Dalia Nandi Das
Hafizur Rahaman
Tamal Ghosh
Published in:
ICIIS (2020)
Keyphrases
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data analysis
infrared
real time
case study
image analysis
high speed
integrated circuit
high density
data sets
artificial intelligence
three dimensional
low cost
quantitative analysis
structural analysis
finite element analysis
mathematical modeling