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An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating.
Xinyue Chang
Zhiyu Jin
Yun-Na Sun
Yan Wang
Zhuoqing Yang
Guifu Ding
Published in:
NEMS (2018)
Keyphrases
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heat transfer
thermal conductivity
numerical simulations
high speed
low cost
finite element method
mathematical model
high density
physical design
vlsi implementation
data sets
genetic algorithm
input output
mathematical models
analog vlsi