DEALING WITH HIGH DIMENSIONAL DATA
Experts
- Feiping Nie
- Dacheng Tao
- Jieping Ye
- Min-Ling Zhang
- Yan-Ru Guo
- Hai Tao
- Yu Zhang
- Tyler L. Hayes
- Sei-ichiro Kamata
- Mark Ordowski
- Gerard G. L. Meyer
- Scott C. Trager
- Jianhua Zhao
- Songcan Chen
- Tommy W. S. Chow
- Qing Mai
- Junbin Gao
- Haesun Park
- Dan Feldman
- Matthew R. McKay
- Alok Sharma
- Feng Tang
- Nicolas Auguin
- Wei Bian
- Daniela Rus
- Jing-Han Wu
- Jos B. T. M. Roerdink
- Chun-Na Li
- Yan-Qin Bai
- Edward R. Dougherty
- Yuan Jiang
- Hadi Sadoghi Yazdi
- Lan Bai
- Stan Z. Li
- Ming-Bo Zhao
- Alexandru C. Telea
- Wei Zhou
- Xuelong Li
- Yuan-Hai Shao
Venues
- CoRR
- ICASSP
- Expert Syst. Appl.
- Pattern Recognit.
- IEEE Trans. Knowl. Data Eng.
- IEEE Trans. Neural Networks Learn. Syst.
- NIPS
- ICPR (2)
- IEEE Trans. Pattern Anal. Mach. Intell.
- IEEE Signal Process. Lett.
- ICIP
- Pattern Recognit. Lett.
- Comput. Syst. Sci. Eng.
- INTERSPEECH
- ICPR
- ACM Trans. Knowl. Discov. Data
- IEICE Trans. Inf. Syst.
- IEEE Trans. Signal Process.
- IJCNN
- Appl. Intell.
- Digit. Signal Process.
- SDM
- IEEE Access
- ECCV (4)
- FSKD
- IEEE Signal Process. Mag.
- ICCSCE
- ICPRAM
- KES (3)
- IJCNN (3)
- IC3
- ESANN
- Oper. Res. Lett.
- RITA
- Australasian Conference on Artificial Intelligence
- Int. J. Artif. Intell. Tools
- J. Multim.
- Appl. Soft Comput.
- Technometrics
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