Yorito Sakano

Publication Activity (10 Years)

Years Active: 2016-2023
Publications (10 Years): 5

Top Topics

Processing Capabilities

Cmos Technology

Cmos Image Sensor

Spatially Varying

Top Venues

Publications

Satoko Iida, Daisuke Kawamata, Yorito Sakano, Takaya Yamanaka, Shohei Nabeyoshi, Tomohiro Matsuura, Masahiro Toshida, Masahiro Baba, Nobuhiko Fujimori, Adarsh Basavalingappa, Sungin Han, Hidetoshi Katayama, Junichiro Azami
A 3.0 µm Pixels and 1.5 µm Pixels Combined Complementary Metal-Oxide Semiconductor Image Sensor for High Dynamic Range Vision beyond 106 dB. Sensors 23 (21) (2023)
Yorito Sakano, Takahiro Toyoshima, Ryosuke Nakamura, Tomohiko Asatsuma, Yuki Hattori, Takayuki Yamanaka, Ryoichi Yoshikawa, Naoki Kawazu, Tomohiro Matsuura, Takahiro Iinuma, Takahiro Toya, Tomohiko Watanabe, Atsushi Suzuki, Yuichi Motohashi, Junichiro Azami, Yasushi Tateshita, Tsutomu Haruta
5.7 A 132dB Single-Exposure-Dynamic-Range CMOS Image Sensor with High Temperature Tolerance. ISSCC (2020)
Yusuke Oike, Kentaro Akiyama, Luong D. Hung, Wataru Niitsuma, Akihiko Kato, Mamoru Sato, Yuri Kato, Wataru Nakamura, Hiroshi Shiroshita, Yorito Sakano, Yoshiaki Kitano, Takuya Nakamura, Takayuki Toyama, Hayato Iwamoto, Takayuki Ezaki
8.3 M-Pixel 480-fps Global-Shutter CMOS Image Sensor with Gain-Adaptive Column ADCs and Chip-on-Chip Stacked Integration. IEEE J. Solid State Circuits 52 (4) (2017)
Yusuke Oike, Kentaro Akiyama, Luong D. Hung, Wataru Niitsuma, Akihiko Kato, Mamoru Sato, Yuri Kato, Wataru Nakamura, Hiroshi Shiroshita, Yorito Sakano, Yoshiaki Kitano, Takuya Nakamura, Takayuki Toyama, Hayato Iwamoto, Takayuki Ezaki
An 8.3M-pixel 480fps global-shutter CMOS image sensor with gain-adaptive column ADCs and 2-on-1 stacked device structure. VLSI Circuits (2016)
Kentaro Akiyama, Yusuke Oike, Yoshiaki Kitano, Junichiro Fjimagari, Wakiyama Satoru, Yorito Sakano, Takayuki Toyama, Hayato Iwamoto, Takayuki Ezaki, Takuya Nakamura, Tetsunori Imaizumi, Nonaka Yasuhiro
A front-illuminated stacked global-shutter CMOS image sensor with multiple chip-on-chip integration. 3DIC (2016)