Yi-Bin Lee

Publication Activity (10 Years)

Years Active: 2009-2020
Publications (10 Years): 4

Top Topics

Convolutional Neural Network

Radio Frequency

Top Venues

Publications

Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, Wei-Hao Chiu, Anson Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, Bernard Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, Guang-Kaai Dehng
RFIC and RF Module for 5G Applications. VLSI-DAT (2020)
Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Hung, Wei-Hao Chiu, Anson Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, Bernard Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, Guang-Kaai Dehng
10.3 A 12nm CMOS RF Transceiver Supporting 4G/5G UL MIMO. ISSCC (2020)
Yi-Bin Lee, Yeh Huann Goh, Lum Kin Yun
Study of Convolutional Neural Network in Recognizing Static American Sign Language. ICSIPA (2019)
Chih-Chun Tang, Yi-Bin Lee, Chih-hao Eric Sun, Cheng-Chieh Lin, Jin-Siang Syu, Min-Hua Wu, YangChuan Chen, Tzu-Chan Chueh, Carl Bryant, Manel Collados, Mohammed Hassan, Joao Ramos, Yu-Lin Hsieh, Hsinhung Chen, Xiaochuan Guo, Hsinhua Chen, Changhua Cao, Daniel Li, Jon Strange, Caiyi Wang, Guang-Kaai Dehng
An LTE-A Multimode Multiband RF Transceiver with 4RX/2TX Inter-Band Carrier Aggregation, 2-Carrier 4×4 MIMO with 256QAM and HPUE Capability in 28nm CMOS. ISSCC (2019)
Ming-Da Tsai, Chih-Fan Liao, Chi-Yun Wang, Yi-Bin Lee, Bosen Tzeng, Guang-Kaai Dehng
20.7 A multi-band inductor-less SAW-less 2G/3G-TD-SCDMA cellular receiver in 40nm CMOS. ISSCC (2014)
Pei-Wei Chen, Tser-Yu Lin, Ling-Wei Ke, Rickey Yu, Ming-Da Tsai, Stanley Yeh, Yi-Bin Lee, Bosen Tzeng, Yen-Horng Chen, Sheng-Jui Huang, Yu-Hsin Lin, Guang-Kaai Dehng
A 0.13 µm CMOS Quad-Band GSM/GPRS/EDGE RF Transceiver Using a Low-Noise Fractional-N Frequency Synthesizer and Direct-Conversion Architecture. IEEE J. Solid State Circuits 44 (5) (2009)