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Shilin Fu
ORCID
Publication Activity (10 Years)
Years Active: 2020-2024
Publications (10 Years): 10
Top Topics
Texture Information
Degraded Images
Expression Recognition
Image Restoration
Top Venues
CoRR
Int. J. Comput. Intell. Syst.
Remote. Sens.
Multim. Tools Appl.
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Publications
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Bo Fu
,
Shilin Fu
,
Yuechu Wu
,
Yuanxin Mao
,
Yonggong Ren
,
Dang N. H. Thanh
Deep non-blind deblurring network for saturated blurry images.
Neural Comput. Appl.
36 (14) (2024)
Xiaoxin Chen
,
Yongdong Wang
,
Yusen Chen
,
Shilin Fu
,
Na Zhou
NDVI-Based Assessment of Land Degradation Trends in Balochistan, Pakistan, and Analysis of the Drivers.
Remote. Sens.
15 (9) (2023)
Bo Fu
,
Yuhan Dong
,
Shilin Fu
,
Yuechu Wu
,
Yonggong Ren
,
Dang N. H. Thanh
Multistage supervised contrastive learning for hybrid-degraded image restoration.
Signal Image Video Process.
17 (2) (2023)
Dabiao Wang
,
Shilin Fu
,
Hang Lu
Numerical study of supercritical CO2 cooling in horizontal threaded tube.
AIBDF
(2023)
Bo Fu
,
Yuanxin Mao
,
Shilin Fu
,
Yonggong Ren
,
Zhongxuan Luo
Blindfold Attention: Novel Mask Strategy for Facial Expression Recognition.
ICMR
(2022)
Bo Fu
,
Liyan Wang
,
Yuechu Wu
,
Yufeng Wu
,
Shilin Fu
,
Yonggong Ren
Weak texture information map guided image super-resolution with deep residual networks.
Multim. Tools Appl.
81 (24) (2022)
Bo Fu
,
Yuhan Dong
,
Shilin Fu
,
Yuanxin Mao
,
Dang N. H. Thanh
Learning domain transfer for unsupervised magnetic resonance imaging restoration and edge enhancement.
Int. J. Imaging Syst. Technol.
32 (1) (2022)
Bo Fu
,
Liyan Wang
,
Ruizi Wang
,
Shilin Fu
,
Fangfei Liu
,
Xin Liu
Underwater Image Restoration and Enhancement via Residual Two-Fold Attention Networks.
Int. J. Comput. Intell. Syst.
14 (1) (2021)
Bo Fu
,
Liyan Wang
,
Yuechu Wu
,
Yufeng Wu
,
Shilin Fu
,
Yonggong Ren
Week Texture Information Map Guided Image Super-resolution with Deep Residual Networks.
CoRR
(2020)
Bo Fu
,
Shilin Fu
,
Liyan Wang
,
Yuhan Dong
,
Yonggong Ren
Deep Residual Split Directed Graph Convolutional Neural Networks for Action Recognition.
IEEE Multim.
27 (4) (2020)