R. Leroy

Publication Activity (10 Years)

Years Active: 2012-2015
Publications (10 Years): 1

Top Topics

Thermal Conductivity

Solder Ball Connect

Prediction Model

Top Venues

Microelectron. Reliab.

Publications

Sébastien Jacques, R. Leroy, Marc Lethiecq
PAK package reliability during thermal cycling applications. Microelectron. Reliab. 55 (9-10) (2015)
Sébastien Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. Microelectron. Reliab. 52 (1) (2012)