Ping Wang

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 9

Top Topics

Spatial Reasoning

Machine Learning

Scale Parameter

Top Venues

IEEE Commun. Lett.

IEEE Wirel. Commun. Lett.

IEEE Trans. Commun.

Publications

Shuang Li, Ping Wang, Li Yang, Binna Zhou, Hao Li, Tao Liu, Yating Du
Performance Evaluation of the Vertical Layered UWOC System With Spatial Diversity. IEEE Wirel. Commun. Lett. 13 (7) (2024)
Binna Zhou, Ping Wang, Tian Cao, Ganggang Li, Shuang Li, Pengfei Yang
Performance analysis of AUV-carried RISs-aided multihop UWOC convergent with RF MRC systems over WGG oceanic turbulence. Veh. Commun. 45 (2024)
Ganggang Li, Ping Wang, Ting Yang, Hui Che
Secrecy Sum-Rate Enhancement for NOMA-VLC System With Pseudo User. IEEE Commun. Lett. 27 (1) (2023)
Chenge Shi, Mingjian Cheng, Lixin Guo, Martin P. J. Lavery, Ping Wang, Songhua Liu, Renxian Li, Jiangting Li
Particle Scattering Induced Orbital Angular Momentum Spectrum Change of Vector Bessel-Gaussian Vortex Beam. Remote. Sens. 14 (18) (2022)
Weina Pang, Ping Wang, Maojie Han, Shuang Li, Pengfei Yang, Ganggang Li, Lixin Guo
Optical Intelligent Reflecting Surface for Mixed Dual-Hop FSO and Beamforming-Based RF System in C-RAN. IEEE Trans. Wirel. Commun. 21 (10) (2022)
Wei Wang, Ping Wang, Weina Pang, Yuting Pan, Yuanhao Nie, Lixin Guo
Evolution Properties and Spatial-Mode UWOC Performances of the Perfect Vortex Beam Subject to Oceanic Turbulence. IEEE Trans. Commun. 69 (11) (2021)
Wei Wang, Ping Wang, Yatong Song, Weina Pang, Shuang Li, Yuanhao Nie
Machine Learning Framework Combining Radial Phase Grating and Channel Information-Assisted Underwater Wireless Optical OAM Communications. IEEE Commun. Lett. 25 (11) (2021)
Shuqiang Niu, Ping Wang, Sihui Chi, Zhongyu Liu, Weina Pang, Lixin Guo
Enhanced Optical OFDM/OQAM for Visible Light Communication Systems. IEEE Wirel. Commun. Lett. 10 (3) (2021)
Xi Nan, Ping Wang, Lixin Guo, Li Huang, Zhongyu Liu
A Novel VLC Channel Model Based on Beam Steering Considering the Impact of Obstacle. IEEE Commun. Lett. 23 (6) (2019)