Ling gang Liu

Publication Activity (10 Years)

Years Active: 2011-2011
Publications (10 Years): 0

Publications

Junhui Li, Luhua Deng, Bangke Ma, Ling gang Liu, Fuliang Wang, Lei Han
Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging. Microelectron. Reliab. 51 (12) (2011)