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K. H. Song
Publication Activity (10 Years)
Years Active: 1988-2017
Publications (10 Years): 1
Top Topics
Heat Flow
Human Resources
Software Package
Wafer Fabrication
Top Venues
Microelectron. Reliab.
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Publications
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K. H. Song
,
J. S. Jang
Semiconductor package qualification based on the swelling temperature.
Microelectron. Reliab.
69 (2017)
Y. H. Song
,
K. H. Song
,
Kisik S. Lee
The implementation activities and strategies for value added network in Korea.
ICCC
(1988)