Ju Meng

Publication Activity (10 Years)

Years Active: 2017-2017
Publications (10 Years): 2

Top Topics

Finite Element Model

Material Properties

Top Venues

Microelectron. Reliab.

Publications

Chunsheng Guo, Ju Meng, Zhiheng Liao, Shiwei Feng, Xun Wang, Lin Luo
Influence of heat source size on thermal resistance of AlGaN/GaN HEMT. ASICON (2017)
Zhiheng Liao, Chunsheng Guo, Ju Meng, Boyang Jiang, Li Gao, Ya Su, Ruomin Wang, Shiwei Feng
Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation. Microelectron. Reliab. 74 (2017)