Hua Lu

Publication Activity (10 Years)

Years Active: 2005-2006
Publications (10 Years): 0

Publications

Hua Lu, Helen Shi, Ming Zhou
Thermally induced deformation of solder joints in real packages: Measurement and analysis. Microelectron. Reliab. 46 (7) (2006)
Hua Lu, Jesse Zhou, Rich Golek, Ming Zhou
Hybrid reliability assessment for packaging prototyping. Microelectron. Reliab. 45 (3-4) (2005)