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Furkan Eris
ORCID
Publication Activity (10 Years)
Years Active: 2018-2023
Publications (10 Years): 9
Top Topics
Random Forest
Memory Hierarchy
Tree Ensembles
Network Design
Top Venues
CoRR
DATE
DAC
ICCAD
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Publications
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Furkan Eris
,
Marcia S. Louis
,
Kubra Eris
,
José Luis Abellán Miguel
,
Ajay Joshi
Puppeteer: A Random Forest Based Manager for Hardware Prefetchers Across the Memory Hierarchy.
ACM Trans. Archit. Code Optim.
20 (1) (2023)
Cansu Demirkiran
,
Furkan Eris
,
Gongyu Wang
,
Jonathan Elmhurst
,
Nick Moore
,
Nicholas C. Harris
,
Ayon Basumallik
,
Vijay Janapa Reddi
,
Ajay Joshi
,
Darius Bunandar
An Electro-Photonic System for Accelerating Deep Neural Networks.
ACM J. Emerg. Technol. Comput. Syst.
19 (4) (2023)
Furkan Eris
,
Marcia S. Louis
,
Kubra Eris
,
José L. Abellán
,
Ajay Joshi
Puppeteer: A Random Forest-based Manager for Hardware Prefetchers across the Memory Hierarchy.
CoRR
(2022)
Cansu Demirkiran
,
Furkan Eris
,
Gongyu Wang
,
Jonathan Elmhurst
,
Nick Moore
,
Nicholas C. Harris
,
Ayon Basumallik
,
Vijay Janapa Reddi
,
Ajay Joshi
,
Darius Bunandar
An Electro-Photonic System for Accelerating Deep Neural Networks.
CoRR
(2021)
Sadullah Canakci
,
Leila Delshadtehrani
,
Furkan Eris
,
Michael Bedford Taylor
,
Manuel Egele
,
Ajay Joshi
DirectFuzz: Automated Test Generation for RTL Designs using Directed Graybox Fuzzing.
DAC
(2021)
Furkan Eris
,
Sadullah Canakci
,
Cansu Demirkiran
,
Ajay Joshi
Custom Tailored Suite of Random Forests for Prefetcher Adaptation.
CoRR
(2020)
Ayse K. Coskun
,
Furkan Eris
,
Ajay Joshi
,
Andrew B. Kahng
,
Yenai Ma
,
Aditya Narayan
,
Vaishnav Srinivas
Cross-Layer Co-Optimization of Network Design and Chiplet Placement in 2.5-D Systems.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
39 (12) (2020)
Ayse K. Coskun
,
Furkan Eris
,
Ajay Joshi
,
Andrew B. Kahng
,
Yenai Ma
,
Vaishnav Srinivas
A cross-layer methodology for design and optimization of networks in 2.5D systems.
ICCAD
(2018)
Furkan Eris
,
Ajay Joshi
,
Andrew B. Kahng
,
Yenai Ma
,
Saiful A. Mojumder
,
Tiansheng Zhang
Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon.
DATE
(2018)