Claudius Feger

Publication Activity (10 Years)

Years Active: 2005-2011
Publications (10 Years): 0

Publications

Soojae Park, Claudius Feger
Thermal fracture toughness measurement for underfill during temperature change. Microelectron. Reliab. 51 (3) (2011)
Claudius Feger
Packaging issues for 22nm and beyond. SBCCI (2011)
Claudius Feger, Jeffrey D. Gelorme, Maurice McGlashan-Powell, Dilhan M. Kalyon
Mixing, rheology, and stability of highly filled thermal pastes. IBM J. Res. Dev. 49 (4-5) (2005)
Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad
Effects of mechanical stress and moisture on packaging interfaces. IBM J. Res. Dev. 49 (4-5) (2005)