Investigation on Contacts Thermal Stability for 3D Sequential Integration.

S. J. Mao J. B. Liu Y. Wang W. B. Liu Y. P. Hu H. W. Cui R. Zhang H. C. Liu Z. X. Wang N. Zhou Y. K. Zhang Hong Yang Zhenhua Wu Yongliang Li J. F. Gao Anyun Du Junfeng Li Jun Luo Wenwu Wang Huaxiang Yin

Published in: IRPS (2022)

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