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Model and simulation of Warpage in packaged IC strips after Mold Array Process.
Jose L. Ramirez
Ricardo T. Yoshioka
Carolina C. P. Nunes
Igor Fernandes Namba
Claudemir Coral
Published in:
SBCCI (2020)
Keyphrases
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process model
computational model
mathematical model
analytical model
optimization process
decision making
design process
simulation model
formal model
agent based modeling
statistical model
simulation study
agent model