Login / Signup
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging.
De-Shau Huang
Wen-Bin Tu
Xiu-Ming Zhang
Liang-Te Tsai
Ti-Yuan Wu
Ming-Tzer Lin
Published in:
Microelectron. Reliab. (2016)
Keyphrases
</>
optimal design
high speed
heat transfer
water supply
structural design
real time
numerical solution
selection mechanism
constraint handling
multiscale
software components
learning mechanism