Experimental and statistical study in adhesion features of bonded interfaces of IC packages.
Chi-Hui ChienThaiping ChenWei-Bang LinChi-Chang HsiehYii-Der WuCheng-Hsiu YehPublished in: Microelectron. Reliab. (2008)
Keyphrases
- statistical analysis
- feature extraction
- real world
- theoretical framework
- feature set
- benchmark datasets
- prior knowledge
- low level
- co occurrence
- empirical studies
- experimental study
- qualitative and quantitative
- statistical information
- classification accuracy
- real time
- feature vectors
- object recognition
- decision trees
- information theoretic
- extracted features
- comparative analysis