(Ba, Sr)TiO3 dielectrics for future stacked- capacitor DRAM.
David E. KoteckiJohn D. BanieckiHua ShenRobert B. LaibowitzKatherine L. SaengerJingyu Jenny LianThomas M. ShawSatish D. AthavaleCyril Cabral Jr.Peter R. DuncombeMartin GutscheGerhard KunkelYoung-Jin ParkYun-Yu WangRichard WisePublished in: IBM J. Res. Dev. (1999)