Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology.
Rahul MathurChien-Ju ChaoRossana LiuNikhil TadepalliPranavi ChandupatlaShawn HungXiaoqing XuSaurabh SinhaJaydeep KulkarniPublished in: CoRR (2020)