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A novel efficient TSV built-in test for stacked 3D ICs.

Badi GuibaneBelgacem HamdiBrahim BensalemAbdellatif Mtibaa
Published in: Turkish J. Electr. Eng. Comput. Sci. (2018)
Keyphrases
  • cost effective
  • efficient implementation
  • data mining
  • machine learning
  • computer vision
  • feature selection
  • face recognition
  • objective function
  • association rules
  • hidden markov models
  • lightweight