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Advanced Thermal Modeling of IC - Package Interaction.

Zhibo CaoMatteo StocchiMatthias WietstruckFederico GarbugliaDiego PinciniMehmet Kaynak
Published in: RWS (2020)
Keyphrases
  • user interaction
  • infrared
  • modeling language
  • database
  • real time
  • data sets
  • real world
  • social networks
  • three dimensional
  • multiscale
  • information technology
  • open source
  • integrated circuit
  • human interaction