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TDDB improvement of copper/dielectric in the highly-integrated BEOL structure for 28nm technology node and beyond.

Cheng Pu ChiuYen-Chun LiuBin-Siang TsaiYi-Jing WangYeh-Sheng LinYun-Ru ChenChien-Lin WengSheng-Yuan HsuehJack HungHo-Yu LaiJei-Ming ChenAlbert H.-B. ChengChien-Chung Huang
Published in: IRPS (2015)
Keyphrases
  • graph structure
  • tree structure
  • significant improvement
  • medical images
  • x ray
  • input output