TDDB improvement of copper/dielectric in the highly-integrated BEOL structure for 28nm technology node and beyond.
Cheng Pu ChiuYen-Chun LiuBin-Siang TsaiYi-Jing WangYeh-Sheng LinYun-Ru ChenChien-Lin WengSheng-Yuan HsuehJack HungHo-Yu LaiJei-Ming ChenAlbert H.-B. ChengChien-Chung HuangPublished in: IRPS (2015)