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Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist.

Kyounghwan NaIl-hwan KimEunsung LeeHyeon Cheol KimYong-Hwan LeeKukjin Chun
Published in: ICMENS (2006)
Keyphrases
  • integrated circuit
  • machine learning
  • computer vision
  • e learning
  • metadata
  • image segmentation
  • similarity measure
  • bayesian networks
  • multiresolution
  • massively parallel