Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load.
Tz-Cheng ChiuJyun-Ji LinHung-Chun YangVikas GuptaPublished in: Microelectron. Reliab. (2010)
Keyphrases
- computational model
- real time
- experimental data
- theoretical analysis
- prediction model
- simulation model
- neural network model
- hierarchical structure
- load balancing
- mathematical model
- theoretical framework
- distributed systems
- probabilistic model
- prior knowledge
- artificial neural networks
- high level
- case study
- genetic algorithm