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Research on High Precision Micro-assembly Technology for Automated MEMS Thermopile Chip Die Bonding Process.
Yongtao Jiang
Shanshan Feng
Haibo Huang
Liguo Chen
Published in:
ROBIO (2018)
Keyphrases
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high precision
high recall
high reliability
high speed
real time
case study
low cost
printed circuit boards
achieve high precision
data processing