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Research on High Precision Micro-assembly Technology for Automated MEMS Thermopile Chip Die Bonding Process.

Yongtao JiangShanshan FengHaibo HuangLiguo Chen
Published in: ROBIO (2018)
Keyphrases
  • high precision
  • high recall
  • high reliability
  • high speed
  • real time
  • case study
  • low cost
  • printed circuit boards
  • achieve high precision
  • data processing