Login / Signup
Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges.
Masaaki Koganemaru
Toru Ikeda
Noriyuki Miyazaki
Published in:
Microelectron. Reliab. (2008)
Keyphrases
</>
finite element analysis
stress distribution
integrated circuit
finite element
using artificial neural networks
computer aided design
finite element model
artificial intelligence
high speed
evaluation method
database systems
artificial neural networks
material properties
temperature field