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Exploring SOI Device Structures and Interconnect Architectures for 3-Dimensional Integration.

Rongtian ZhangKaushik RoyCheng-Kok KohDavid B. Janes
Published in: DAC (2001)
Keyphrases
  • high speed
  • multi dimensional
  • data integration
  • information integration
  • silicon on insulator
  • databases
  • neural network
  • information retrieval
  • case study
  • business processes
  • data acquisition