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A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators.

Zhongxu WangHuai WangYi ZhangFrede Blaabjerg
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • computational model
  • mathematical model
  • probabilistic model
  • neural network
  • modular structure
  • high level
  • objective function
  • parameter estimation