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The Study of Inspection on Thin Film Resistance Strain Gauge Contact Failure by Electrical Excitation Thermal-Wave Imaging.
Peng Song
Junyan Liu
Fei Wang
Xiaogang Sun
Published in:
IEEE Trans. Ind. Electron. (2022)
Keyphrases
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thin film
image processing
artificial neural networks
factors influencing
solder ball connect
data streams
low cost
grounded theory