Login / Signup

The Study of Inspection on Thin Film Resistance Strain Gauge Contact Failure by Electrical Excitation Thermal-Wave Imaging.

Peng SongJunyan LiuFei WangXiaogang Sun
Published in: IEEE Trans. Ind. Electron. (2022)
Keyphrases
  • thin film
  • image processing
  • artificial neural networks
  • factors influencing
  • solder ball connect
  • data streams
  • low cost
  • grounded theory