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Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).

Aziz OukairaDhaou SaidJamal ZbitouAhmed Lakhssassi
Published in: IMCOM (2023)
Keyphrases
  • low cost
  • finite element method
  • high speed
  • heat transfer
  • simulated annealing
  • genetic algorithm
  • object recognition
  • control system
  • numerical simulations